Safety Information: GORE® SKYFLEX® Aerospace Materials, 700 Series
Safety Information, 영어
W. L. Gore & Associates developed GORE® SKYFLEX® Aerospace Materials, 700 Series, to combat the many sealing and surface protection challenges experienced by civil and military aircraft. With several decades of proven successful applications, they simplify installation, as well as drastically reduce manufacturing cycles and time spent on direct maintenance, thanks to their flexible, lightweight design and non-curing properties.
The following regulatory, safety, and best practices information correlate with GORE SKYFLEX Aerospace Materials, 700 Series. If you have questions about using these products for your specific application, contact a Gore representative.
Regulatory Information
Supplied as a rolled good or die-cut gasket on a carrier film, GORE SKYFLEX Aerospace Materials, 700 Series do not contain any of the REACH Regulation (EU/1907/2006) Candidate List of Substances of Very High Concern (SVHC) at concentrations above 0.1% (w/w) as published by the European Chemicals Agency (ECHA). They are described in EC Regulation 1907/2006/EC and defined as the following:
- An article in the United States per OSHA Regulation 29 CFR 1910.1200(b)(6)(v) during normal intended use
- A “manufactured item” under Canadian CEPA regulations
Further, all Gore products are pre-qualified and tested to meet the latest industry standards. As a result, a Safety Data Sheet (SDS) or Material Safety Data Sheet (MSDS) is not required for GORE SKYFLEX Aerospace Materials, 700 Series. It is important to note, however, that the carrier film should be removed at the point of use.
Safety Information
Made of non-hazardous substances, maintenance personnel don’t have to use personal protective equipment (PPE) when they install, remove and repair GORE SKYFLEX Aerospace Materials, 700 Series (with adhesive or no adhesive). However, hazardous decomposition byproducts may form if the materials are involved in a fire or cut/removed using burning, grinding or elevated temperature processes. These byproducts could include:
- Hydrogen
- Silicon oxides
- Formaldehyde
- Carbon dioxide
- Carbonyl fluoride
- Carbon monoxide
- Hydrogen fluoride
- Tetrafluoroethylene
- Perfluoroisobutylene
- Hexafluoropropylene
- Traces of incompletely burned carbon products
Recommended Standard Practices
For the installation or repair of GORE SKYFLEX Aerospace Materials, 700 Series, Gore recommends the following standard practices be used to reduce exposure to decomposition byproducts:
- Download Gore’s step-by-step instructions or how-to videos.
- Do not heat the materials with adhesive over 120°C (248°F) or non-adhesive materials over 260°C (500°F).
- Note: The temperature will be dependent on the specified adhesive.
- If not using effective local exhaust ventilation and PPE, avoid doing the following to the materials:
- Burning
- Grinding
- High-temperature cutting
- Melting
- Protect the materials from potential fire sources and remember that hydrogen fluoride fumes emitted during a fire may react with water, forming hydrofluoric acid.
- In the event of a fire, follow these steps:
- Use full PPE, including a self-contained breathing apparatus, to avoid developing symptoms pertaining to polymer fume fever.
- Wear neoprene gloves when handling refuse from a fire.
- Adhere to local, state, national and international regulations when disposing of the materials.
Learn More about GORE SKYFLEX Aerospace Materials, 700 Series (with Adhesive or No Adhesive)
Tapes and gaskets from W. L. Gore & Associates are available in a variety of material sets, forms, and sizes and are often used as an alternative to Form-In-Place (FIP) seals. Visit www.gore.com/skyflex for more information about GORE SKYFLEX Aerospace Materials, 700 series, or our host of other solutions for military and civil aircraft. If you have additional questions after reviewing our datasheets, installation guides and instructional videos, connect with a member of our team.
FOR INDUSTRIAL USE ONLY
Not for use in food, drug, cosmetic or medical device manufacturing, processing, or packaging operations.